Assembly
Provides functions for microfluidic chips including automatic feeding, laser welding, laser cutting, UV bonding, UV curing, sterile cleaning, vacuum drying, reagent pre-loading (nL level and above), lyophilized bead dispensing and component assembly, full-process visual inspection, in-line packaging, in-line QR code labeling, and automatic unloading.
Debubbling
Finished product cartoning
Liquid encapsulation
Visual inspection
Film feeding and cutting
Chip loading
Cap opening/closing
Unloading and cartoning
Microsphere dispensing